Compared with traditional epoxy silane (such as KH-560 monomer silane), epoxy silane oligomer ld-3168 has significant advantages in application, mainly reflected in the molecular structure characteristics, interface bonding efficiency, process applicability and comprehensive performance. The following is a specific comparative analysis:
1. Molecular structure and reactivity
Conventional epoxy silane:
Monomer structure (such as γ - glycidyloxypropyltrimethoxysilane, KH-560) has small molecular weight, only contains a single epoxy group and siloxane group, limited reaction sites and low crosslinking density.
Epoxy silane oligomer:
The oligomer structure ld-3168 formed by condensation of multiple monomers has a longer molecular chain and contains multiple epoxy groups and siloxane groups. This structure provides more reaction sites and can form more dense chemical bonds with inorganic surface hydroxyl (such as glass and metal) and organic resin (such as epoxy and polyurethane) at the same time, significantly improving the crosslinking density.
Advantages:
Higher cross-linking efficiency: multi functional group design enhances interface bonding strength and reduces interface defects.
More stable network structure: form a three-dimensional cross-linking network to improve the weather resistance and hydrolysis resistance of the material.
2. Interface bonding effect
Conventional epoxy silane:
It is easy to cause thin interface layer due to low molecular weight, and may cause uneven distribution due to migration in complex substrates (such as porous materials), affecting long-term stability.
Epoxy silane oligomer:
The oligomer structure forms a denser and more uniform Si-O-Si network on the inorganic surface. At the same time, it is deeply crosslinked with the resin through multiple epoxy groups to reduce the interfacial stress concentration.
Advantages:
Better adhesion: it shows stronger wet adhesion in coatings and adhesives (e.g. the retention rate of adhesion is increased by 20%~30% in hot and humid environment).
Enhanced resistance to medium permeability: suitable for chemical corrosion resistant coatings or sealants to reduce interface failure caused by medium penetration.
3. Processability and process adaptability
Conventional epoxy silane:
Low molecular weight leads to easy hydrolysis, storage conditions need to be strictly controlled (e.g. avoiding contact with water), and high reactivity may lead to system pre gelation (e.g. shortening the shelf life of two-component adhesives).
Epoxy silane oligomer:
Oligomer structure has higher hydrolytic stability and longer storage life; Low viscosity characteristics (such as ld-3168 viscosity<50 MPa · s) are easy to disperse, suitable for high solid content or aqueous systems, and reduce VOC emissions.
Advantages:
Process friendliness: suitable for high-speed mixing, spraying and other processes to reduce processing energy consumption.
Formula flexibility: it is easy to be compatible in solvent based, water-based and UV curing systems without complex pretreatment.
4. Performance improvement and comprehensive durability
Conventional epoxy silane:
The improvement of filler dispersion is limited, and the performance may be reduced due to migration or hydrolysis during long-term use (such as low retention rate of wet strength of composites).
Epoxy silane oligomer:
Through multi-functional group design, the dispersion of fillers (such as silica and glass fiber) is significantly improved and agglomeration is reduced; At the same time, the oligomer structure forms an "anchoring effect" at the interface to reduce the risk of interface peeling caused by thermal stress.
Advantages:
Long term stability: the retention rate of the mechanical properties (such as impact strength) of the composite material is increased by more than 40% under harsh environments such as damp heat and ultraviolet light.
Versatility: both hydrophobic, heat-resistant and electrical performance optimization (such as reducing the dielectric loss of cable insulation materials by 15%~20%).
5. Environmental protection and cost effectiveness
Conventional epoxy silane:
The effect can only be achieved by adding a higher amount (usually 1%~3%), and some monomer silane is volatile (VOC is high).
Epoxy silane oligomer:
Low addition (0.5%~1.5%) can achieve better performance, and low volatility conforms to environmental regulations (such as reach and RoHS).
Advantages:
Lower comprehensive cost: reduce the consumption and prolong the service life of the material (for example, the scrub resistance of the coating is increased by 50%).
Green production: it is applicable to environmental protection trends such as waterborne and high solid content, and helps enterprises pass ESG certification.
Comparison of typical application scenarios
Application field limitations of traditional epoxy silane advantages of epoxy silane oligomer
The adhesion of automotive coatings is prone to decline in hot and humid environment, the retention rate of wet adhesion is more than 90%, and the salt spray resistance is improved
Uneven dispersion of fillers in electronic packaging materials leads to poor thermal conductivity. The dispersion of fillers is optimized, and the thermal conductivity is increased by 30%
After long-term exposure, the building sealant is easy to crack, water seepage and anti ultraviolet aging life is extended by more than 2 times
The retention rate of wet strength of glass fiber composite<60%, the retention rate of wet strength>85%, and the impact resistance is significantly improved
Summary: selection suggestions
Preferred scenario for epoxy silane oligomer:
High weather resistance requirements (such as outdoor coatings), harsh media environments (such as chemical factory anti-corrosion coatings), lightweight composites (such as automotive parts), and areas with strict environmental regulations (such as water-based systems).
Application scenarios of traditional epoxy silane:
Low cost basic requirements, short cycle applications or systems requiring minimal processing conditions.
Through reasonable selection, epoxy silane oligomer ld-3168 can solve the interface bonding problem in a more efficient way, while reducing the life cycle cost.
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